发明名称 METHOD FOR MANUFACTURING FLAT PANEL DEVICE INTEGRAL WITH TRANSPARENT FACE MATERIAL, AND FLAT PANEL DEVICE INTEGRAL WITH TRANSPARENT FACE MATERIAL
摘要 PROBLEM TO BE SOLVED: To reduce a processing time when pressure-fitting a transparent face material such as a protective board to a flat panel device.SOLUTION: A process, in which an optical resin 3 is placed on a flat panel device 1 and the flat panel device 1 and a transparent face material 2 are pasted together via the optical resin 2, includes a step in which a viscoelastic resin 4 larger in thickness than the optical resin 3 is placed on the periphery of a display area 10 of the flat panel device 1, and a step in which the positions of the flat panel device 1 and the transparent face material 2 are aligned, and are temporarily fixed in place so that the flat panel device 1 and the transparent face material 2 have a clearance therebetween via the viscoelastic resin 4, and further has a step in which the flat panel device 1 and the transparent face material 2 are pasted together via the optical resin 3 in a reduced-pressure atmosphere.
申请公布号 JP2015210399(A) 申请公布日期 2015.11.24
申请号 JP20140092199 申请日期 2014.04.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEDA HIROSHI
分类号 G09F9/00;G02F1/13;G02F1/1333;G06F3/041 主分类号 G09F9/00
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