CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A circuit substrate includes an insulating layer, circuit layers including a first layer on first surface side of the insulating layer and a second layer on second surface side of the insulating layer, conductor heat transfer layers including a first transfer layer on the first side of the insulating layer and a second transfer layer on the second side of the insulating layer, through hole electrical conductors filling first through holes penetrating through the insulating layer such that the electrical conductors connect the first and second layers, and a through hole thermal conductor filling a second through hole penetrating through the insulating layer such that the thermal conductor connects the first and second transfer layers. The second hole is positioned between two or more of the first holes and has a shape extending in direction that intersects direction connecting the two or more of the first holes.

主权项

1. A circuit substrate, comprising:
an insulating layer; a plurality of conductor circuit layers including a first conductor circuit layer formed on a first surface side of the insulating layer and a second conductor circuit layer formed on a second surface side of the insulating layer; a plurality of conductor heat transfer layers including a first conductor heat transfer layer formed on the first surface side of the insulating layer and a second conductor heat transfer layer formed on the second surface side of the insulating layer; a plurality of through hole electrical conductors comprising plating filling a plurality of first through holes penetrating through the insulating layer such that the plurality of through hole electrical conductors is connecting the first and second conductor circuit layers; and a through hole thermal conductor comprising plating filling a second through hole penetrating through the insulating layer such that the through hole thermal conductor is connecting the first and second conductor heat transfer layers, wherein the second through hole is positioned between at least two of the first through holes and has a shape extending in a direction that intersects a direction connecting the at least two of the first through holes.