| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device manufacturing apparatus, which can remove air bubbles without damaging a semiconductor wafer when the air bubbles are entrapped in an adhesive after a covering material is attached to one surface of the semiconductor wafer via the adhesive. <P>SOLUTION: A semiconductor device manufacturing method includes: performing an air bubble movement step of moving air bubbles 4 to a covering material 2 side by application of energy to an adhesive 3 such as expansion/contraction of the adhesive 3, application of oscillation to the adhesive 3 and application of heat to the adhesive 3 in the case where the air bubbles 4 are entrapped in the adhesive 3 after a film 2 is attached to one surface 1a of a semiconductor wafer 1 via the adhesive 3; and subsequently performing a defoaming step of causing the air bubbles 4 in the adhesive 3 to be exposed to an atmospheric air and removing the air bubbles 4 by detaching the film 2 or by forming an opening 2a on the film 2. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
