| 摘要 |
The present invention relates to a multi-layered flexible printed circuit board and a manufacturing method, the flexible printed circuit board having multi-layers in which a substrate and polyimide are attached by insulating resin, wherein the insulting resin includes a film or a copper foil, and a compound coated on the film or the copper foil, wherein the compound is produced by mixing a primary mixture including 30 to 55 weight% of solid epoxy of bisphenol A type, 20 to 40 weight% of flexible anhydride resin, 10 to 20 weight% of high-fluidity epoxy resin, 2 to 7 weight% of phenoxy resin, and 0.5 to 3 weight% of at least one from a silane-based coupling agent, a leveling agent, and an anti-foaming agent, as an additive, with a solvent that is at least one from methyl isobutyl ketone (MIBK) and butyl carbitol to have a predetermined viscosity with respect to 100 weight% of the primary mixture and further with a predetermined amount of a curing accelerator with respect to 100 weight% of the primary mixture as necessary. |
