Wafer, method of manufacturing package, and piezoelectric oscillator

摘要

To provide a wafer, a method of manufacturing a package, and a piezoelectric oscillator in which warping of a wafer body is reduced to improve the yields. A wafer for lid substrate has a product region in which a number of recess portions for cavities are formed and a non-forming region of the recess portions set in the product region in the form of a straight line extending along a diameter direction of the product region.

主权项

1. A method for producing piezoelectric vibrators, the method comprising:
(a) defining at least two groups of first substrates in a first face of a first wafer, the first face opposite to a second face of the first wafer, wherein the first substrates are adjacent one another in a respective at least two groups, and the at least two groups are separated from each other by a blank region in which no substrate is defined, such that a surface area of the first face is sufficiently similar to a surface area of the second face to suppress warping of the first wafer; (b) defining second substrates on a second wafer similarly to the first substrates defined on the first wafer; (c) forming a recess in a respective at least some of the first substrates defined on the first wafer; (d) bonding the first and second wafers such that at least some of the first substrates substantially coincide, respectively, with at least some of the corresponding second substrates, wherein a piezoelectric vibrating strip is inside a respective at least some of the coinciding first and second substrate pairs whose first substrates are formed with the recess; (e) cutting off, from the first and second wafers, respective at least some of the coinciding first and second substrate pairs.