Embedding thin chips in polymer

摘要

Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.

主权项

1. An apparatus comprising:
A) a substrate comprising a standoff well region, wherein:
the substrate comprises a layer of a first conductive material disposed on a layer of a flexible polymer, wherein the flexible polymer is further stretchable; anda patterned portion of the first conductive material comprises a standoff bordering a portion of exposed flexible polymer, thereby forming the standoff well region; B) a thin chip disposed within the standoff well region on a portion of the exposed flexible polymer proximate to the standoff; and C) an adhesive material disposed within the standoff well region at a portion of the exposed flexible polymer proximate to the standoff, the thin chip being disposed on the adhesive material proximate the standoff, the adhesive material including a conductive adhesive, wherein a height of the standoff is comparable to a height of the thin chip.