| 摘要 |
The present invention relates to a gas sensor package. The present invention comprises: a substrate; a gas sensing device on the substrate; and a protection cap covering the gas sensing device and having a first vent hole coming in contact with the substrate to be formed. The gas sensing device and the substrate are directly bound by a flip chip bonding method to remove a bonding wire in order to reduce manufacturing costs and significantly minimize the gas sensor package. |
