| 摘要 |
A semiconductor device in which a semiconductor element and other electronic components are disposed on a substrate and which has a lid thermally connected to the semiconductor element. The semiconductor device comprises a package substrate, the semiconductor element, chip components mounted on the package substrate together with the semiconductor element, the lid which is so disposed as to face the package substrate and dissipates the heat of the semiconductor element, and a heat connecting member for thermally connecting the semiconductor element and the lid. Solder is used as the heat connecting member and an anti-adhesive sheet to prevent the heat connecting member which has fused and flowed out during the heating from adhering to the chip components is disposed away from the chip components. |
