| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic control device capable of securing a heat dissipation path for obtaining the sufficient heat dissipation of electronic components mounted on a circuit printed board even when the circuit printed board is inserted from a direction following the component mounting face of the circuit printed board into a casing, and to provide a method of manufacturing the same. <P>SOLUTION: The thickness of a pre-foamed heat dissipation member 4 applied to the surface of an electronic component 2 is set to be less than a distance between a surface of the electric component 2 and the inner surface of the case 5. Thus, when the circuit board 1 is inserted into the case 5, the pre-foamed heat dissipation member 4 is not brought into contact with the inner face of the case so that any portion can be prevented from being shaved off or dropped. Then, the pre-foamed heat dissipation member 4 is formed due to heat after the circuit board 1 is completely inserted into the case 5. Thus, the foamed heat dissipation member 4 expands until it reaches the inner face of the case 5, thereby forming the heat dissipation path reaching from the electronic component 2 to the case 5 and obtaining sufficient heat dissipation. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
