发明名称 |
MANUFACTURING METHOD OF PCB |
摘要 |
<p>A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.</p> |
申请公布号 |
KR20090054291(A) |
申请公布日期 |
2009.05.29 |
申请号 |
KR20070121079 |
申请日期 |
2007.11.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, DONG JIN;JUNG, SEUNG HYUN;KIM, SEUNG CHUL;CHO, SOON JIN |
分类号 |
H05K3/18 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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