SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING OF METAL AND POLISHING METHOD USING THE SAME
摘要
Provided is a slurry composition for chemical mechanical polishing (CMP) of a metal. The slurry composition comprises a copolymer whose average molecular weight is from about 600,000 to about 1,300,000 and whose monomers are acrylic acid and acrylamide in a molar ratio of about 1:30 to about 30: 1. The slurry composition exhibits a non-Prestonian behavior to achieve minimized dishing and attain a high degree of planarization.
申请公布号
WO2009048203(A1)
申请公布日期
2009.04.16
申请号
WO2008KR00377
申请日期
2008.01.21
申请人
CHEIL INDUSTRIES INC.;CHOU, HOMER;KIM, WON LAE;NOH, JONG, IL;LEE, IN KYUNG;LEE, TAE YOUNG
发明人
CHOU, HOMER;KIM, WON LAE;NOH, JONG, IL;LEE, IN KYUNG;LEE, TAE YOUNG