摘要 |
The method involves realizing a flexible semi-conductor substrate (2) in a form of a flexible circuit plate, and fixing the flexible semi-conductor substrate on a substrate support (4) by sticking, welding, laminating and brazing. A surface (8) of the substrate is formed by deforming the support. The support is constituted by a pressed and carved part (5), and the surface of the substrate is curved by zones with LEDs (6), where the LEDs are mounted in a surface or LED semi-conductor plate. |