SEMICONDUCTOR DEVICE AND METHOD OF FORMING SHIELDING LAYER AFTER ENCAPSULATION AND GROUNDED THROUGH INTERCONNECT STRUCTURE

摘要

PURPOSE: A semiconductor device and a method of forming shielding layer after encapsulation and grounded through interconnect structure are provided to prevent the generation of a void in encapsulant around a semiconductor die. CONSTITUTION: A substrate(52) includes a conductive layer. An interconnection structure is formed on a substrate and is electrically connected to the conductive layer. A semiconductor device is mounted in the substrate. An encapsulant is deposited on the semiconductor device and the interconnection structure.