| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a waterproof electronic apparatus capable of avoiding deterioration of waterproof performance caused by warpage and undulation of a case, and the waterproof electronic apparatus manufactured by such a method. <P>SOLUTION: This method of manufacturing the electronic apparatus 100 includes applying an adhesive 40 to a peripheral fringe part 110 along the opening part 120 of an almost box-shaped case 10, one face of which is formed as the opening part 120, and mounting a screen 20 for covering the opening part 120 to the peripheral fringe part 110 to which the adhesive 40 is applied. The peripheral fringe part 110 has the warpage and the undulation, and has a projecting part 80 having a flat top face 70 extending while making a round aound the opening part 120, and the adhesive 40 is applied to the top face 70 of the projecting part 80 over the entire width, and the maximum coating thickness in the width direction is thicker than the maximum height difference in the warpage and the undulation on the top face 70 of the projecting part 80. <P>COPYRIGHT: (C)2013,JPO&INPIT |
