发明名称 Thermal Airlflow Sensor
摘要 An object of the present invention is to provide a thermal airflow sensor that prevents moisture absorption by a silicon oxide film formed closest to a surface (formed to be located on an uppermost portion), and that reduces a measuring error. In order to attain the foregoing object, the thermal airflow sensor according to the present invention applies an ion implantation to a silicon oxide film 4, formed closest to a surface (formed to be located on an uppermost portion), by using an atom or molecule selected from at least any one of silicon, oxygen, and an inert element such as argon or nitrogen, in order to increase a concentration of an atom contained in the silicon oxide film 4 more than that before the ion implantation.
申请公布号 US2013119504(A1) 申请公布日期 2013.05.16
申请号 US201113810814 申请日期 2011.07.06
申请人 ISHITSUKA NORIO;MINAMITANI RINTARO;HANZAWA KEIJI;HITACHI AUTOMOTIVE SYSTEMS, LTD. 发明人 ISHITSUKA NORIO;MINAMITANI RINTARO;HANZAWA KEIJI
分类号 H01L37/00 主分类号 H01L37/00
代理机构 代理人
主权项
地址