| 摘要 |
<p>[Problem] To provide a photosensitive siloxane composition which has high resolution, high heat resistance and high transparency, does not undergo thermal sagging, which may occur during thermal curing, without the need of increasing the molecular weight of a cross linking agent or a siloxane compound, and has properties including high sensitivity and a high film-remaining rate. [Solution] A negative-type photosensitive polysiloxane composition characterized by comprising: (I) (Ia) a polysiloxane having such a property that a prebaked film thereof is soluble in an aqueous 5-wt% tetramethylammonium hydroxide solution at a dissolution rate of 3,000 Å/sec. or less and (Ib) a polysiloxane mixture containing a polysiloxane and having such a property that the dissolution rate of a prebaked film thereof in an aqueous 2.38-wt% tetramethylammonium hydroxide solution is 150 Å/sec. or more; (II) a curing aid; and (III) a solvent.</p> |
