发明名称 受信回路
摘要 <p>A receiving circuit with a simple circuit structure for performing wireless communication utilizing electromagnetic induction is provided. An LSI chip and a storage medium where wireless communication utilizing electromagnetic induction is performed and the circuit scale and circuit size can be reduced are provided. The following receiving circuit may be used: a parallel circuit where two diode elements whose directions are opposite are connected in parallel is used, one end of the parallel circuit is connected to the other end of a coil whose one end is connected to a ground potential line, and a capacitor is connected in series with the other end of the parallel circuit. A transistor whose leakage current is markedly reduced may be used as a diode in the receiving circuit. Such a receiving circuit may be used in an LSI chip or a storage medium.</p>
申请公布号 JP5771505(B2) 申请公布日期 2015.09.02
申请号 JP20110233519 申请日期 2011.10.25
申请人 株式会社半導体エネルギー研究所 发明人 鎌田 康一郎
分类号 H04B1/18;H04B1/59;H04B5/02 主分类号 H04B1/18
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