METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOBILE BODY

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board capable of reducing the deterioration of filling property of a metallic material in a through hole and manufacturing the wiring board having excellent airtightness, and to provide the wiring board having excellent airtightness, an electronic device, an electronic apparatus, and a mobile body with high reliability equipped with the wiring board.SOLUTION: The method for manufacturing the wiring board comprises: a step for preparing a ceramic sintered substrate 211 having a through hole 213, a metallic piece 251, and metallic paste X containing particles consisting of Ti-Ag-Cu-based alloy; a step for arranging the metallic piece 251 in the through hole 213 and arranging the metallic paste X between the metallic piece 251 and the through hole 213; and a step for sintering the metallic paste X and holding the metallic piece 251 to the ceramic sintered substrate 211.