| 发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor device and manufacturing method thereof. Various aspects of the disclosure may, for example, comprise forming a back end of line layer on a dummy substrate, completing at least a first portion of an assembly, and removing the dummy substrate. |
| 申请公布号 |
US2015221573(A1) |
申请公布日期 |
2015.08.06 |
| 申请号 |
US201414313724 |
申请日期 |
2014.06.24 |
| 申请人 |
Amkor Technology, Inc. |
发明人 |
Paek Jong Sik;Park Doo Hyun |
| 分类号 |
H01L23/31;H01L23/00;H01L21/56 |
主分类号 |
H01L23/31 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A manufacturing method of a semiconductor device, the manufacturing method comprising:
forming a back end of line (BEOL) layer on a dummy substrate; electrically connecting a semiconductor die to the BEOL layer; first encapsulating the BEOL layer and the semiconductor die using a first encapsulant; removing the dummy substrate from the BEOL layer; electrically connecting a solder ball to the BEOL layer; second encapsulating the BEOL layer and the solder ball using a second encapsulant; and electrically connecting a semiconductor package to the BEOL layer. |
| 地址 |
Chandler AZ US |
