| 摘要 |
<p>The present invention relates to a chip on film package which can improve reliability regarding arrangement with a flat display panel. The chip on film package comprises: a base film; a semiconductor chip mounted on the base film; a plurality of first pads formed on one side edge of the base film, and connected with a pad of a flat display panel; a first wiring pattern printed on the base film to connect each first pad and the semiconductor chip; and at least one reinforcing material formed to correspond to an edge by one side edge of the base film, and separated from the first pads. The reinforcing agent is formed in a line on the first pads, and includes a pair of reinforcing patterns separated at predetermined distance.</p> |
