Method and circuit for scalable cross point switching using 3-D die stacking

摘要

A cross-point switch having stacked switching dies on a component die is disclosed. The cross point switch allows scalability by adding switching dies. The switching dies include ingress switches that are coupled to multiplexers to a middle stage switches. The inputs and outputs of the ingress switches are connected to the switching interface region via through silicon vias (TSVs). The outputs of the ingress switches are also coupled by TSVs to multiplexers for routing to middle stage switches on a switching die above. If the switching die is stacked on another switching die, the outputs of the ingress switches are coupled by TSVs to the multiplexers for routing to the middle stage switches of the switching die below. By adding switching dies, the switch is configurable to increase the number of ports as well as the width of the ports.

主权项

1. A configurable cross point switching system comprising:
a component die including logic components and a switching interface region to allow connection of the logic components; a first switching die located on the component die, the first switching die including an ingress stage switch having an input and an output and a middle stage switch having an input; a multiplexer having an input coupled to the output of the ingress stage switch and an output coupled to the input of the middle stage switch; an input through-silicon via (TSV) coupled between an input port in the switching interface region and the input of the ingress stage switch; and a second input TSV coupled between a second input port in the switching interface region of the component die and another input of the multiplexer.