ENCAPSULATION, METHOD FOR PREPARING THE SAME, ENCAPSULATION METHOD OF ELECRONIC DEVICE USING THE SAME AND ENCAPSULATED ORGANIC ELECTRONIC DEVICE

摘要

According to one aspect of the present invention, reliability is improved by bonding an organic electronic device to an encapsulant with uniform pressure even though a metal foil with an uneven part is used by supplying an encapsulant which includes the metal foil with the uneven part which includes a concave part and a convex part and a protection film which protects the uneven part of the metal foil. In a bonding process, damage to the uneven part or a pressing device used for bonding is prevented.