BONDING APPARATUS AND METHOD

摘要

The present disclosure relates to methods and apparatuses for mechanically bonding substrates together. The apparatus comprises a bonding roll comprising a base surface and plurality of nubs extending from the base surface, each of the plurality of nubs comprising: a sidewall; a bonding surface; and a shoulder connecting the sidewall to the bonding surface. The shoulder comprises a single chamfer or a radius to, inter alia, reduce tearing of the substrates.

主权项

1. An apparatus for bonding substrates, the apparatus comprising:
a. an anvil roll; and b. a bonding roll comprising a base surface and plurality of nubs extending from the base surface, each of the plurality of nubs comprising:
i. a sidewall;ii. a bonding surface; andiii. a shoulder connecting the sidewall to the bonding surface;wherein the shoulder is chamfered at a 30-degree to 65-degree chamfer angle; wherein a width of the shoulder as measured in a plane parallel to the base surface is from about 0.2 mm to about 0.6 mm; wherein the nub diameter is from 2 mm to 5 mm; and wherein the sidewall is substantially perpendicular to the base surface.