SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To perform electromagnetic wave shielding with high reliability.SOLUTION: A semiconductor manufacturing device 1 comprises: a top cover which is arranged above a top face of a semiconductor package in a state where a tray on which an unshielded semiconductor package to be subjected to electromagnetic wave shielding is mounted is placed on a transfer carrier; and a displacement detection part for detecting abnormality of the top cover occurring when the semiconductor package contacts a lower surface of the top cover and the top cover is lifted upward.