| 摘要 |
According to embodiments of the present invention, a plating process for soldering is executed beforehand on a pad area of a substrate which is welded to a shield case by using a camera manufacturing method, and then the shield case and the substrate are mass-produced. After that, the shield case and the substrate are contacted and are welded by reflowing the plating without an additional soldering process. According to the present invention, a camera manufacturing method is provided. More specifically, a camera manufacturing method comprising; a first plating step of plating a first conductive metal for soldering on a ground pad of the substrate; a contact step of contacting the shield case to a portion which is a plated portion of the ground pad; and a soldering step of soldering the ground pad and the shield case by reflowing the first conductive metal is provided. |
