发明名称 CHEMICAL MECHANICAL POLISHING COMPOSITION COMPRISING POLYVINYL PHOSPHONIC ACID AND ITS DERIVATIVES
摘要 A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(═O)(OR1)(0R2) or phosphonic acid (P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium.
申请公布号 US2015159050(A1) 申请公布日期 2015.06.11
申请号 US201114362510 申请日期 2011.12.21
申请人 Raman Vijay Immanuel;Schade Christian;Venkataraman Shyam Sundar;Su Eason Yu-Shen;Usman Ibrahim Sheik Ansar 发明人 Raman Vijay Immanuel;Li Yuzhuo;Schade Christian;Venkataraman Shyam Sundar;Su Eason Yu-Shen;Usman Ibrahim Sheik Ansar
分类号 C09G1/04;H01L21/306 主分类号 C09G1/04
代理机构 代理人
主权项 1. A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or any combination thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or as a charge reversal agent, wherein the organic polymeric compound comprises a phosphonate (—P(═O)(OR1)(OR2)) or a phosphonic acid (—P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl,and (C) an aqueous medium.
地址 Mannheim DE