| 发明名称 |
APPARATUS AND METHOD FOR PROVIDING A SEAL AROUND A PERIMETER OF A BI-MATERIAL ENCLOSURE |
| 摘要 |
An enclosure includes a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal. The seal is designed to collapse in a specific direction during an injection molding process. The enclosure also includes a second material over-molded on the sub-assembly during the injection molding process. The seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming the bi-material enclosure. The first material and the second material are dissimilar materials with different thermal expansion qualities. |
| 申请公布号 |
US2015145384(A1) |
申请公布日期 |
2015.05.28 |
| 申请号 |
US201314089035 |
申请日期 |
2013.11.25 |
| 申请人 |
MOTOROLA SOLUTIONS, INC |
发明人 |
LEE KIOK YUNG;CHAN CHEE KIT;EEO BOON AIK;HOR WENG KONG;OOI BAN HIN;PAKIAM CLEMENT TOBIAS XAVIER |
| 分类号 |
H04M1/02;B29C45/14 |
主分类号 |
H04M1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An enclosure, comprising;
a seal co-molded to a first material to form a sub-assembly in which the first material is securely adhered to the seal, wherein the seal is designed to collapse in a specific direction during an injection molding process; and a second material over-molded on the sub-assembly during the injection molding process, wherein the seal is compressed in the specific direction during the injection molding process to produce a consistent wetting at least at one desired perimeter joint between the seal and the over-molded second material, forming a bi-material enclosure, wherein the first material and the second material are dissimilar materials with different thermal expansion qualities. |
| 地址 |
Schaumburg IL US |
