Semiconductor device

摘要

A semiconductor device is provided, which comprises a first semiconductor package, a second semiconductor package, and a connection structure. The first semiconductor package includes a first substrate. The first substrate includes a first region and a second region. The second semiconductor package is mounted on the first semiconductor package. The connection structure electrically connects the second semiconductor package and the first semiconductor package. The connection structure comprises first connection patterns at the first region. The first connection patterns provide a data signal at the first region. The connection structure further comprises second connection patterns at the second region. The second connection patterns provide a control/address signal at the second region. A number of the second connection patterns is less than a number of the first connection patterns.

主权项

1. A semiconductor device comprising:
a first semiconductor package including a first substrate, the first substrate including a first region and a second region; a connection structure electrically connecting the first semiconductor package and a second semiconductor package, wherein the connection structure comprises:
first connection patterns at the first region, the first connection patterns providing a data signal at the first region; andsecond connection patterns at the second region, the second connection patterns providing a control/address signal at the second region, wherein a surface area of the first region at which the data signal is provided is greater than a surface area of the second region at which the control/address signal is provided.