| 发明名称 |
Fan Out Package Structure and Methods of Forming |
| 摘要 |
An embodiment is a structure comprising a die having a pad on a surface and an encapsulant at least laterally encapsulating the die. The pad is exposed through the encapsulant. The structure further includes a first dielectric layer over the encapsulant and the die, a first conductive pattern over the first dielectric layer, and a second dielectric layer over the first conductive pattern and the first dielectric layer. The first dielectric layer and the second dielectric layer have a first opening to the pad of the die. The structure further includes a second conductive pattern over the second dielectric layer and in the first opening. The second conductive pattern adjoins a sidewall of the first dielectric layer in the first opening and a sidewall of the second dielectric layer in the first opening. |
| 申请公布号 |
US2015137379(A1) |
申请公布日期 |
2015.05.21 |
| 申请号 |
US201314081853 |
申请日期 |
2013.11.15 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wang Pu;Shih Ying-Ching;Lu Szu-Wei;Lin Jing-Cheng |
| 分类号 |
H01L23/522;H01L21/768;H01L21/56;H01L23/31 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A structure comprising:
a die having a pad on a surface; an encapsulant at least laterally encapsulating the die, the pad being exposed through the encapsulant; a first dielectric layer over the encapsulant and the die; a first conductive pattern over the first dielectric layer; a second dielectric layer over the first conductive pattern and the first dielectric layer, the first dielectric layer and the second dielectric layer having a first opening to the pad of the die; and a second conductive pattern over the second dielectric layer and in the first opening, the second conductive pattern adjoining a sidewall of the first dielectric layer in the first opening and a sidewall of the second dielectric layer in the first opening. |
| 地址 |
Hsin-Chu TW |
