半导体制造装置用晶舟,申请号TW103300468-传众专利搜索

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发明名称	半导体制造装置用晶舟
摘要
申请公布号	TWD167988	申请公布日期	2015.05.21
申请号	TW103300468	申请日期	2014.01.24
申请人	日立国际电气股份有限公司	发明人	吉田秀成;谷山智志
分类号	15-99	主分类号	15-99
代理机构		代理人	林志刚台北市中山区南京东路2段125号7楼
主权项
地址	日本

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