发明名称 マイクロエレクトロニクス用の加工物を処理するための装置
摘要 <p>Apparatuses, and related methods, for processing a workpiece that include a particular barrier structure that can overlie and cover a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular movable member that can be positioned over and moved relative to a workpiece. Apparatuses, and related methods, for processing a workpiece that include a particular ceiling structure that can overlie a processing chamber. Nozzle devices, and related methods, that include a particular annular body. Nozzle devices, and related methods, that include a particular first, second, and third nozzle structure.</p>
申请公布号 JP5721084(B2) 申请公布日期 2015.05.20
申请号 JP20130000616 申请日期 2013.01.07
申请人 发明人
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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