BONDING APPARATUS

摘要

The present invention relates to a bonding apparatus. More specifically, the bonding apparatus according to the present invention forms a bonding subject by laminating an anisotropic conductive adhesive between a first substrate including a first electrode and a second substrate including a second electrode, and the bonding subject is bound by the anisotropic conductive adhesive. The bonding apparatus comprises: a stage of supporting the bonding subject and a bonding tool which pressurizes the bonding subject, wherein the stage pushes the first substrate from the first electrode region to the direction of the second electrode to form a protruding pattern bonding the regions, for forming the electrodes, preferentially with the anisotropic conductive adhesive. Therefore, when the bonding apparatus bonds the bonding subject by changing the shape of the stage, flow of the anisotropic conductive adhesive is prevented, thus securing a uniform hardening in the whole region, including electrode and bonding regions.