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发明名称
半導体装置
摘要
申请公布号
JP5721782(B2)
申请公布日期
2015.05.20
申请号
JP20130133319
申请日期
2013.06.26
申请人
发明人
分类号
H01L21/338;H01L21/336;H01L21/337;H01L27/098;H01L29/778;H01L29/78;H01L29/808;H01L29/812
主分类号
H01L21/338
代理机构
代理人
主权项
地址
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