| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate inspection device which can perform inspection of electronic characteristic of a semiconductor device with high efficiency.SOLUTION: A substrate inspection device comprises: a probe card 15 having a plurality of probe needles 17 which contact respective electrodes of a semiconductor devices formed on a wafer; and a test box 14 electrically connected to the probe card 15. A card side inspection circuit of the probe card 15 reproduces a circuit configuration such as a circuit configuration of a function enhanced card, for example, in which a semiconductor device which is cut out from the wafer W and converted into a commercial reality is mounted, and a box side inspection circuit 21 of the test box 14 reproduces a circuit configuration such as a part of a mother board circuit configuration, in which the semiconductor device is mounted.</p> |
