发明名称 Light emitting element lamp and lighting equipment
摘要 A light emitting element lamp and a lighting equipment for suppressing a temperature rising of a substrate on which a light emitting element is mounted by using a reflector is described. Aspects relate to a lamp including a heat-conductive reflector, a base connected to the reflector, a heat-conductive heat radiating member, a substrate having a light emitting element mounted thereon and attached to the heat radiating member and a lighting circuit housed in the cover to light the light emitting element. Other components and features may also be included.
申请公布号 US9018828(B2) 申请公布日期 2015.04.28
申请号 US201213679206 申请日期 2012.11.16
申请人 Toshiba Lighting & Technology Corporation 发明人 Tanaka Toshiya;Osawa Shigeru;Hisayasu Takeshi
分类号 H01J1/02;H01J7/24;H01J61/52;H01K1/58;F21V29/00;F21K99/00;F21V19/00;F21V7/00;F21V23/00;F21Y101/02;F21V7/20;F21Y105/00 主分类号 H01J1/02
代理机构 Banner & Witcoff, Ltd. 代理人 Banner & Witcoff, Ltd.
主权项 1. A light emitting element lamp comprising: a heat conductor having an opening portion at one end side and an opening portion at another end side, and having inner and outer surfaces that widen toward the opening portion at the one end side, and a heat radiating member disposed between the one end side opening portion and the other end side opening portion so as to separate the openings from each other in a separation direction, wherein the heat conductor includes a recessed portion formed at a portion between the one end side and the other end side of the heat conductor, and the heat radiating member is provided with a flange portion in surface-contact with and extending along an inner surface of the heat conductor so as to form a surface continuous to the inner surface of the heat conductor, wherein a peripheral surface of the heat conductor is exposed to an exterior of the lamp; a cover portion having a surface attached to the heat conductor; a substrate provided with a light emitting element, wherein a surface of the substrate is thermally connected to an inside surface of the heat radiating member and wherein the light emitting element in the lamp is disposed on the substrate; a lighting circuit housed in a space formed in the recessed portion of the heat conductor so as to be separated from the heat radiating member, wherein the lighting circuit is configured to light the light emitting element; an insulating member disposed around the lighting circuit; and a base provided to another end side portion of the heat conductor protruding from the recessed portion.
地址 Yokosuka-shi, Kanagawa-ken JP