发明名称 Three dimensional structrue plated PCB for LED lighting
摘要 <p>The present invention relates to a three-dimensional LED substrate for light emission and, more particularly, to a three-dimensional LED substrate for light emission capable of three-dimensionally comprising an LED device on a flat substrate by desirably bending the LED device. According to the present invention, a defective rate of a product is minimized and a bending operation is facilitated by bending and pressing a small area in each LED device by a blanking line. Also, the present invention is economically implemented by not requiring the change of an existing process. An efficient emission range is provided by controlling an emission angle in each LED device.</p>
申请公布号 KR20150041543(A) 申请公布日期 2015.04.16
申请号 KR20130120208 申请日期 2013.10.08
申请人 发明人
分类号 F21S2/00 主分类号 F21S2/00
代理机构 代理人
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