| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic circuit board in which excellent heat dissipation effect is achieved by optimizing the pressing load of a heat sink against an electronic component, and suppressing positional deviation of the heat sink from the electronic component in a horizontal direction.SOLUTION: An electronic circuit board includes a substrate body on the surface of which an electronic component is mounted, a heat transfer material applied to the electronic component, a heat sink provided on the electronic component via the heat transfer material, and dissipating heat radiated from the electronic component, a fixing member provided at a position separated from the electronic component on the substrate body, and more than one connection bodies each having a first end fixed to the heat sink and a second end on the opposite side of the first end fixed to the substrate body via the fixing member. The connection body is a leaf spring and presses the heat sink against the electronic component.</p> |
