发明名称 Implantable electrical stimulation systems with shielded control module and methods for making and using
摘要 An implantable control module for an electrical stimulation system includes a header coupled a sealed body. The header includes at least one connector assembly. The control module also includes a conductive shield disposed over at least a portion of the connector assembly or connector assemblies of the header. The conductive shield is provided to hinder generation of current in the header or in a portion of a lead received in the header in response to application of an external radiofrequency (RF) or magnetic field. A similar shield can also be used to shield a connector assembly disposed on the end of a lead extension or any other component of the electrical stimulation system.
申请公布号 US9008778(B2) 申请公布日期 2015.04.14
申请号 US201313971262 申请日期 2013.08.20
申请人 Boston Scientific Neuromodulation Corporation 发明人 Gupta Gaurav;Carbunaru Rafael;Gururaj Kiran;McDonald Matthew Lee;Venook Ross Daniel
分类号 A61N1/375;A61N1/36;A61N1/16 主分类号 A61N1/375
代理机构 Lowe Graham Jones PLLC 代理人 Lowe Graham Jones PLLC ;Black Bruce E.
主权项 1. An implantable control module for an electrical stimulation system, the control module comprising: a sealed body; an electronic subassembly disposed in the sealed body and configured and arranged to generate electrical stimulation signals for delivery through a lead coupled to the implantable control module; a header coupled to the sealed body, the header comprising at least one connector assembly, each connector assembly defining a port with each connector assembly configured and arranged to receive a proximal portion of a lead inserted into the port, the header further comprising a plurality of contacts disposed within each connector assembly and configured and arranged to make contact with terminals disposed on a lead when the lead and terminals are received in the connector assembly and to electrically couple the terminals of the lead to the electronic subassembly; and a conductive shield disposed over at least a portion of the at least one connector assembly of the header, wherein the conductive shield is configured and arranged to hinder generation of current in the header or in a portion of a lead received in the header in response to application of an external radiofrequency (RF) or magnetic field, wherein the conductive shield comprises a substrate and a plurality of conductive stripes or conductive slats disposed on the substrate and arranged parallel to the at least one connector assembly, wherein the conductive shield is disposed over at least a portion of the header.
地址 Valencia CA US