发明名称 |
Implantable electrical stimulation systems with shielded control module and methods for making and using |
摘要 |
An implantable control module for an electrical stimulation system includes a header coupled a sealed body. The header includes at least one connector assembly. The control module also includes a conductive shield disposed over at least a portion of the connector assembly or connector assemblies of the header. The conductive shield is provided to hinder generation of current in the header or in a portion of a lead received in the header in response to application of an external radiofrequency (RF) or magnetic field. A similar shield can also be used to shield a connector assembly disposed on the end of a lead extension or any other component of the electrical stimulation system. |
申请公布号 |
US9008778(B2) |
申请公布日期 |
2015.04.14 |
申请号 |
US201313971262 |
申请日期 |
2013.08.20 |
申请人 |
Boston Scientific Neuromodulation Corporation |
发明人 |
Gupta Gaurav;Carbunaru Rafael;Gururaj Kiran;McDonald Matthew Lee;Venook Ross Daniel |
分类号 |
A61N1/375;A61N1/36;A61N1/16 |
主分类号 |
A61N1/375 |
代理机构 |
Lowe Graham Jones PLLC |
代理人 |
Lowe Graham Jones PLLC ;Black Bruce E. |
主权项 |
1. An implantable control module for an electrical stimulation system, the control module comprising:
a sealed body; an electronic subassembly disposed in the sealed body and configured and arranged to generate electrical stimulation signals for delivery through a lead coupled to the implantable control module; a header coupled to the sealed body, the header comprising at least one connector assembly, each connector assembly defining a port with each connector assembly configured and arranged to receive a proximal portion of a lead inserted into the port, the header further comprising a plurality of contacts disposed within each connector assembly and configured and arranged to make contact with terminals disposed on a lead when the lead and terminals are received in the connector assembly and to electrically couple the terminals of the lead to the electronic subassembly; and a conductive shield disposed over at least a portion of the at least one connector assembly of the header, wherein the conductive shield is configured and arranged to hinder generation of current in the header or in a portion of a lead received in the header in response to application of an external radiofrequency (RF) or magnetic field, wherein the conductive shield comprises a substrate and a plurality of conductive stripes or conductive slats disposed on the substrate and arranged parallel to the at least one connector assembly, wherein the conductive shield is disposed over at least a portion of the header. |
地址 |
Valencia CA US |