发明名称 Light emitting component and manufacturing method thereof
摘要 A light emitting component, and more particularly to a white light emitting component with high light emitting efficiency are provided. The white light emitting component with high light emitting efficiency has properties of high driving voltage, high color render index and concentrated optical density. The light emitting component includes a plurality of different light emitting diode chip groups for emitting a number of lights in different wavelength ranges and a wavelength conversion fluorescent material. A manufacturing method by stacking miniature light emitting diode chip groups to form the white light emitting component is also provided.
申请公布号 US8994049(B2) 申请公布日期 2015.03.31
申请号 US201113012919 申请日期 2011.01.25
申请人 Interlight Optotech Corporation 发明人 Chou His-yan
分类号 H01L25/075;H01L27/15;H01L33/62;H01L33/50 主分类号 H01L25/075
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. A light emitting component comprising: a leadframe; a first insulating substrate disposed on the leadframe; a second insulating substrate, disposed on the first insulating substrate, and exposing a region of the first insulating substrate; a first light emitting diode chip group disposed on the region and configured to emit a first light; a second light emitting diode chip group disposed on the second insulating substrate at an elevation, from the leadframe, higher than that of the first light emitting diode chip group and configured to emit a second light; and a wavelength conversion fluorescent material disposed on the first light emitting diode chip group and the second light emitting diode chip group, the wavelength conversion fluorescent material being configured to absorb a part of the first light and emit a third light, wherein the first light, the second light, and the third light have different wavelength ranges.
地址 Yangmei, Taoyuan County TW