发明名称 |
Electronic device and method for controlling temperature thereof |
摘要 |
A method for controlling a temperature of an electronic device which includes a semiconductor chip is provided. The temperature control method includes measuring a temperature of a measurement point using the electronic device, comparing the temperature of the measurement point with a target temperature varying according to a period of time when the semiconductor chip operates using the electronic device, and decreasing a clock frequency of the semiconductor chip using the electronic device when the temperature of the measurement point is higher than the target temperature. |
申请公布号 |
US8988115(B2) |
申请公布日期 |
2015.03.24 |
申请号 |
US201313830651 |
申请日期 |
2013.03.14 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim Jaechoon;Ju SangWook;Cho Eunseok |
分类号 |
H01L35/00;H03K3/011;G06F1/20;G06F1/32;G06F11/30 |
主分类号 |
H01L35/00 |
代理机构 |
F. Chau & Associates, LLC |
代理人 |
F. Chau & Associates, LLC |
主权项 |
1. A method for controlling a temperature of an electronic device which includes a semiconductor chip, comprising:
measuring a temperature of a measurement point using the electronic device, wherein the measurement point is a point of the semiconductor chip; computing a surface temperature of the electronic device based on the measured temperature of the measurement point and calculated thermal resistance between the measurement point and a surface of the electronic device, wherein the surface of the electronic device is a part different from the semiconductor chip; and decreasing a clock frequency of the semiconductor chip using the electronic device when the computed surface temperature of the electronic device is higher than a first target temperature. |
地址 |
Suwon-Si, Gyeonggi-Do KR |