| 发明名称 |
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PRODUCTION OF PRINTED WIRING BOARD USING SAME |
| 摘要 |
A pretreatment agent for electroless plating is provided, which includes: a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula: C4H9—(OC2H4)m—OH where m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula: C4H9—(OC3H6)n—OH where n is an integer of 1 to 4. Also provided are a method for pretreating a substrate to be used for a printed wiring board, and a process for producing a printed wiring board, both of which include using a pretreatment agent for electroless plating as described above. |
| 申请公布号 |
US2015072070(A1) |
申请公布日期 |
2015.03.12 |
| 申请号 |
US201414478332 |
申请日期 |
2014.09.05 |
| 申请人 |
C. Uyemura & Co., Ltd |
发明人 |
SAIJO Yoshikazu;YAMAMOTO Hisamitsu;UTSUMI Masayuki;OKAMACHI Takuya;KOMEDA Takuya |
| 分类号 |
H05K3/38;H05K3/18 |
主分类号 |
H05K3/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A pretreatment agent for electroless plating, comprising:
a fluorine compound; a surfactant; and at least one solvent selected from ethylene-based glycol butyl ethers of formula:
C4H9—(OC2H4)m—OHwhere m is an integer of 1 to 4, and propylene-based glycol butyl ethers of formula:
C4H9—(OC3H6)n—OHwhere n is an integer of 1 to 4. |
| 地址 |
Osaka JP |
