| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition excellent in reliability without generating a leak failure, a short circuit failure between wires and a wire open failure when a bias is applied in high temperature and high humidity, and a resin sealing type semiconductor device using the same.SOLUTION: The semiconductor sealing epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a hydrotalcite-like compound represented by the following general formula (1) and (E) an inorganic filler as an essential component. The hydrotalcite-like compound of the (D) component is 2.4≤Mg/Al (2.4≤a/b) and an un-sintered hydrotalcite-like compound has peaks of a (001) plane and a (002) plane in a layer direction observed by X-ray diffraction.</p> |
