| 摘要 |
Provided is a light emitting device module. An embodiment includes a circuit board where a first conductive layer, a first insulating layer, and a second insulating layer are successively formed, and a cavity is formed; and a light emitting device which is arranged in the cavity and is electrically connected to the first conductive layer and the second conductive layer. The bottom side of the cavity is exposed to the first conductive layer. The sidewall of the cavity is inclined to the first insulating layer and the second conducive layer and at least part of the second insulating layer. |
