发明名称 グロープラグ制御装置の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a glow plug control device that covers the periphery of an insert part of a multichip module with a shaping material without fixing the module to a mold, and a method for manufacturing the same. <P>SOLUTION: A GCU 100 includes a plate-shaped primary molding unit covered with a molding material to be filled in a cavity 27 in a mold 20 through a gate 25, and a control unit 40 which is accommodated in the primary molding unit 70 to control heat generation of a glow plug. An opposing edge part 71 opposite to the opening part 25a of the gate 25 to be opened in the cavity 27 in the primary molding unit 70 is configured to reduce the thickness thereof toward the opening part 25a. The molding material to be filled in the cavity 27 smoothly flows along the opposing edge part 71, thereby reducing resistance to be applied to the primary molding unit 70 from the molding material. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5672057(B2) 申请公布日期 2015.02.18
申请号 JP20110037405 申请日期 2011.02.23
申请人 发明人
分类号 H01L21/56;B29C45/14;F02P19/02;F23Q7/00 主分类号 H01L21/56
代理机构 代理人
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