| 摘要 |
<p>The present invention relates to a multistep cleaning apparatus of a wafer on which a chemical mechanical polishing process is performed, capable of successively cleaning the wafer on which the chemical mechanical polishing process is performed. Provided is the multistep cleaning apparatus of the wafer which includes a first cleaning module which cleans the wafer on which the chemical mechanical polishing process is performed, a second cleaning module which cleans the wafer processed on the first cleaning module, a moving unit which moves the wafer, and a first buffer module which loads the wafer before the wafer cleaned on the first cleaning module is supplied to the second cleaning module. Thereby, the present invention improves the efficiency of a cleaning process and reduces cleaning time by minimizing the standby time of the multistep cleaning process to remove foreign materials on the wafer in a chemical mechanical process.</p> |
