发明名称 基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板
摘要 PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic part to be embedded in a board, and a printed circuit board having a multilayer ceramic electronic part embedded therein.SOLUTION: A ceramic body is a hexahedron, and includes: an active layer including first and second internal electrodes formed to be alternately exposed from both end faces of the body via a dielectric layer to form a capacity; upper and lower cover layers disposed on and below the active layer; and first and second external electrodes formed on both side end portions of the ceramic body. The first external electrode includes a first base electrode and a first terminal electrode formed on the first base electrode. The second external electrode includes a second base electrode and a second terminal electrode formed on the second base electrode. A first internal electrode positioned at an outermost position is connected to the first base electrode by one or more first vias extended to one or more first and second main surfaces of the ceramic body. A second internal electrode positioned at an outermost position is connected to the second base electrode by second vias in a similar manner.
申请公布号 JP2015023274(A) 申请公布日期 2015.02.02
申请号 JP20130269713 申请日期 2013.12.26
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG HWA;KIM DOO YOUNG;LEE HAI JOON;JUNG JIN MAN
分类号 H01G4/30;H01G4/12;H01G4/232;H05K3/46 主分类号 H01G4/30
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