| 摘要 |
The invention relates to an electrical connection arrangement between at least one flat conductor or conductor section and a cable, wherein the flat conductor or conductor section leads to a wafer, in particular a composite wafer and electrical or electronic components situated there, and the cable is part of an electrical external terminal, wherein furthermore the flat conductor or conductor section is formed on a carrier film, in particular polyimide film. Said electrical connection arrangement also has an encapsulation in the form of injection-moulded plastic, at least in the region of the electrical contact point between cable and flat conductor or conductor section. According to the invention, an adhesion-promoting, heat-activated adhesive film is applied in the region of the carrier film, leaving the space for the electrical contact point free but surrounding the latter, wherein the injection-moulded plastic encapsulation is realised after the electrical connection has been made at the contact point, and in the process the introduction of pressure and temperature activates the adhesive film such that a highly leakproof and durable connection is achieved. |
