发明名称 半導体装置とその製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device including at least a coil, a semiconductor element and a permanent magnet and capable of putting a closed circuit formed of the coil and the semiconductor element in an opening state when magnetizing an unmagnetized magnet element assembly, and to provide a method of manufacturing the same. <P>SOLUTION: This semiconductor device includes the coil 2 and the semiconductor element 12 forming the closed circuit in use. As a means for opening the closed circuit when magnetizing the magnet element assembly 220 after installing the unmagnetized magnet element assembly 220 inside a device 6, power source wiring passages 100 and 200 respectively connected to the coil 2 and the semiconductor element 12 are connected to a plurality of respectively separate independent male terminal metal fittings 30 and 50 and are stored-fixed in a male connector 33 arranged in the semiconductor device 6, one female terminal metal fitting 70 connected to an external power source wiring passage 700 is stored-fixed in a female connector 73, and the plurality of male terminal metal fittings 30 and 50 and the one female terminal metal fitting 70 are connected by fitting of the female-male connectors 33 and 73. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5644541(B2) 申请公布日期 2014.12.24
申请号 JP20110013123 申请日期 2011.01.25
申请人 株式会社デンソー 发明人 水野 大介
分类号 F02P15/00 主分类号 F02P15/00
代理机构 代理人
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