| 发明名称 | Seal structure | ||
| 摘要 | Provided is a seal structure which can reduce the thickness of an electronic device, can be easily assembled and disassembles, and can exhibit an excellent seal performance. Thus, the seal structure for an electronic device, which seals a gap between a flexible wiring substrate inserted to a through-hole provided in a case member of an electronic device and the through-hole, is comprised of an annular gasket composed of a rubber elastic material, a part of which is integrally molded with the flexible wiring substrate, and a retainer plate for retaining the gasket in conjunction with the case member. | ||
| 申请公布号 | US8912454(B2) | 申请公布日期 | 2014.12.16 |
| 申请号 | US201113698596 | 申请日期 | 2011.06.30 |
| 申请人 | Nippon Mektron, Ltd. | 发明人 | Sasaki Takashi |
| 分类号 | H05K7/00;H04M1/02;H04M1/18 | 主分类号 | H05K7/00 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A seal structure for an electronic equipment which seals a gap between a flexible wiring board inserted to a through hole provided in a case member of the electronic equipment and said through hole, the seal structure comprising: an annular gasket which is integrally formed on a part of said flexible wiring board and is made of a rubber elastic material; and a presser plate which pinches said gasket with respect to said case member, wherein a seal projection portion of said gasket continuously exists on both surfaces of said flexible wiring board including a region in which said gasket is integrally formed on said flexible wiring board. | ||
| 地址 | JP | ||