SEMICONDUCTOR PACKAGE

摘要

Disclosed is a semiconductor package. The semiconductor package of the present invention includes: a substrate which has a first surface and a second surface facing the first surface; a pair of conductive lead members which are separated from each other on the first surface of the substrate; a first semiconductor chip which is arranged on the first surface between the lead members; a second semiconductor chip which is installed on the upper sides of the lead members and the first semiconductor chip; a first connection member which electrically connects the first semiconductor chip and the lead members; a second connection member which electrically connects the second semiconductor chip and the substrate; and a third connection member which electrically connects the substrate and the lead members.